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    • Home
    • Products
      • Superconducting Cables
      • Silicon Beam Splitters
      • Terahertz Filters
      • Micro Flex Circuits
      • Polarizers
    • Our Services
      • 3D Semiconductor Etching
      • Nano Ablation
      • Light Assisted Wire EDM
      • Laser Leak Testing
    • Engineering tools
      • Freq, Wavelength, Energy
      • Laser Beam Spot Calc
    • Contact Us
    • Jobs
    • Micro 3D Blog
    • Case Studies
      • Probe Cards
      • Terahertz Filters
      • Superconducting Cables
      • Micro Metal Mesh
      • Flex Circuits and Cables
    • Store
    • Technology Applications
Nielson Scientific
  • Home
  • Products
    • Superconducting Cables
    • Silicon Beam Splitters
    • Terahertz Filters
    • Micro Flex Circuits
    • Polarizers
  • Our Services
    • 3D Semiconductor Etching
    • Nano Ablation
    • Light Assisted Wire EDM
    • Laser Leak Testing
  • Engineering tools
    • Freq, Wavelength, Energy
    • Laser Beam Spot Calc
  • Contact Us
  • Jobs
  • Micro 3D Blog
  • Case Studies
    • Probe Cards
    • Terahertz Filters
    • Superconducting Cables
    • Micro Metal Mesh
    • Flex Circuits and Cables
  • Store
  • Technology Applications

3D Semiconductor Etching

Our Technology

As powerful as today's microfabrication tools are, they are limited to 2.5 geometries (i.e., extruded 2D). This places significant limits on the design of microstructures, which in many cases either compromises device performance or makes certain potential devices unmanufacturable. At Nielson Scientific, we believe the next major step in microfabrication is to go to true D. Our proprietary 3D semiconductor microfabrication technique has been described as "The Nanoscribe for Semiconductors".


See our publication in Nature here.

More Information

Some of the materials we have shown this technique in are Silicon, Silicon Carbide, and Diamond. Many other semiconductors, such as Gallium Nitride, are currently under investigation.
Pictured is an example of this method used to create a non-line-of-sight, high-aspect-ratio via in Silicon Carbide. This feature was cut in half and viewed in an SEM to create the image. For microfluidic applications, the via is left open, while for signal routing applications, the via is electroplated to conduct the signal.

About Nielson Scientific LLC

Our Results

Three-dimensional through wafer vias have been used in various projects to get signals through very efficiently to where they need to go. Pictured is a microscope image and a corresponding x-ray image showing the parallel vias. 

Our Vision

With complete 3D freedom signals between chiplets can be connected in a much smaller footprint. Pictured is a rendering of this concept that is enabled by true 3D microfabrication. 

Video of 3D etching inside a Silicon Carbide wafer

Contact Us

Let us know how this capability can help in your research!

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Nielson Scientific LLC

180 North University Avenue, Suite 270, Provo, Utah 84601, United States

(385) 743-1119

Copyright © 2024 Nielson Scientific LLC - All Rights Reserved.

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