We design and build microsystem solutions
About Nielson Scientific LLC
Our Results
Three-dimensional through wafer vias have been used in various projects to get signals through very efficiently to where they need to go. Pictured is a microscope image and a corresponding x-ray image showing the parallel vias.
Our Vision
With complete 3D freedom signals between chiplets can be connected in a much smaller footprint. Pictured is a rendering of this concept that is enabled by true 3D microfabrication.