High Speed Nano ablation

Our direct-write laser ablation technology is able to create feature sizes down less than one micron with positioning accuracy of 50 nanometers. With precise control over pulsed laser power, we can selectively remove thin film layers as thin as 50 nm leaving the underlying substrate intact, including polymeric substrates. Increasing the power enables complete material removal through a substrate. High-accuracy substrate surface scanning enables surface tracking and material removal on non-planar surfaces. 

This technology enables a fast design, fabrication, and testing cycle not available with lithography. Additionally, it is scalable and can be used to make microscale features across areas much larger than conventional lithography. We are implementing a new capability that will allow micro-scale features to be patterned across an area of up to 80 cm x 80 cm.